Research Papers by Shin-Kun Ryia

Fig. 1. SEM image of before Cu-reflow. Pd–Cu–Ni ternary alloyed dense film was deposited on the porous nickel support using sputtering improved by copper reflow technique. Cupper reflow was good enough technique to remove the defects and delamination on the membrane surface. A Pd–Cu–Ni ternary alloy

This kind of porous nickel support has very small uniform pore size of 33 nm comparing to commercial porous ceramic and stainless steel substrate. Therefore, porous nickel support can be offered as new support material for palladium and palladium-base alloyed composite membrane.